Systems, devices and methods for analyzing and processing samples

ABSTRACT

An example embodiment may include a hyperspectral analyzation subassembly configured to obtain information for a sample. The hyperspectral analyzation subassembly may include one or more transmitters configured to generate electromagnetic radiation electromagnetically coupled to the sample, one or more sensors configured to detect electromagnetic radiation electromagnetically coupled to the sample, and an electromagnetically transmissive window. At least one of the sensors may be configured to detect electromagnetic radiation from the sample via the window. The hyperspectral analyzation subassembly may include an analyzation actuation subassembly configured to actuate at least a portion of the hyperspectral analyzation subassembly in one or more directions of movement with respect to the sample.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Patent Application No.62/108,003, filed Jan. 26, 2015, entitled “SYSTEMS, DEVICES AND METHODSFOR ANALYZING AND PROCESSING SAMPLES,” which is incorporated byreference in its entirety.

BACKGROUND

The present disclosure generally relates to systems, devices and methodsfor analyzing and processing samples. Information about the samples maybe obtained through a variety of analysis techniques such as microscopy,spectroscopy, spectrometry, chromatography, as well as many others.Information about the samples may be used to conduct experiments;improve, control or monitor production processes; or improve, control ormonitor manufactured products.

The claimed subject matter is not limited to embodiments that solve anydisadvantages or that operate only in environments such as thosedescribed above. This background is only provided to illustrate examplesof where the present disclosure may be utilized.

SUMMARY

The present disclosure generally relates to systems, devices and methodsfor analyzing and processing samples or analytes. Information about thesamples may be obtained through a variety of analysis techniques such asmicroscopy, spectroscopy, spectrometry, chromatography, as well as manyothers. Information about the samples may be used to conductexperiments; improve, control or monitor production processes; orimprove, control or monitor manufactured products.

In an example configuration

This Summary introduces a selection of concepts in a simplified formthat are further described below in the Detailed Description. ThisSummary is not intended to identify key features or essentialcharacteristics of the claimed subject matter, nor is it intended to beused as an aid in determining the scope of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a non-limiting embodiment of a systemconfigured to analyze or process samples.

FIGS. 2A-2B are perspective views of a non-limiting embodiment of asystem configured to analyze or process samples.

FIGS. 2C-2E are perspective views of a portion of the system of FIGS.2A-2B.

FIGS. 3A-3D are perspective views of a head assembly of the system ofFIGS. 2A-2B.

FIGS. 3E-3F are perspective views of a portion of the head assembly ofFIGS. 3A-3D.

FIGS. 4A-4B are perspective views of an interface assembly of the systemof FIGS. 2A-2B.

FIGS. 5A-5B are perspective views of a portion of the interface assemblyof FIGS. 4A-4B.

FIG. 5C is a cross-sectional view of the interface assembly of FIGS.4A-4B.

FIG. 6A is a perspective view of a non-limiting embodiment of the systemof FIGS. 2A-2B with a device configured to analyze one or more samplespositioned in a sample tray.

FIG. 6B is a perspective view of a non-limiting embodiment of the systemof FIGS. 2A-2B with a device configured to analyze layers of samples.

FIG. 6C is a perspective view of a non-limiting embodiment of the systemof FIGS. 2A-2B with a device configured to analyze granular samples.

FIG. 7A is a perspective view of the non-limiting embodiment of thedevice of FIG. 6A.

FIG. 7B is a perspective view of a portion of the device of FIG. 7A.

FIG. 7C is another perspective view of the device of FIG. 7A.

FIG. 7D is a top view of the device of FIG. 7A.

FIGS. 8A-8D are representations of scanning methods of the system ofFIGS. 2A-2B.

FIG. 9 illustrates an example configuration of a method.

FIGS. 10A-10B illustrate perspective views of a non-limiting embodimentof a device configured to analyze fluid samples.

FIGS. 10C is a side section view of the device of FIGS. 10A-10B.

FIGS. 10D is a side section view of a portion of the device of FIGS.10A-10B.

FIGS. 10E is a schematic diagram of an example configuration of thedevice of FIGS. 10A-10B .

FIGS. 10F is a schematic diagram of a portion of the exampleconfiguration of FIG. 10E.

FIGS. 11A-11B are perspective views of non-limiting embodiments ofsystems that may be configured to be used as a part of production lineto analyze and process samples.

FIG. 12A is a schematic diagram of an analysis configuration that may beused in immersion microscopy.

FIGS. 12B-12D are schematic diagrams of another analysis configurationthat may be used in immersion microscopy.

FIGS. 12E-12G are schematic diagrams of other analysis configurations.

FIGS. 12H-12J illustrate a non-limiting embodiment of an array.

DETAILED DESCRIPTION

Reference will be made to the drawings and specific language will beused to describe various aspects of the disclosure. Using the drawingsand description in this manner should not be construed as limiting thescope of the disclosure. Additional aspects may be apparent in light ofthe disclosure, including the claims, or may be learned by practice. Thedrawings are non-limiting, diagrammatic, and schematic representationsof example embodiments, and are not necessarily drawn to scale.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used to enablea clear and consistent understanding of the disclosure. It is to beunderstood that the singular forms “a,” “an,” and “the” include pluralreferents unless the context clearly dictates otherwise. Thus, forexample, reference to “a component surface” includes reference to one ormore of such surfaces.

By the term “substantially” it is meant that the recited characteristic,parameter, or value need not be achieved exactly, but that deviations orvariations, including for example, tolerances, measurement error,measurement accuracy limitations and other factors known to thoseskilled in the art, may occur in amounts that do not preclude the effectthe characteristic was intended to provide.

The term “granular sample” may include single crystalline particles,polycrystalline particles, granulated particles, granulatedmulticomponent particles, micronized particles, single component orblended substances, or any combination thereof. In some aspects,“granular sample” may include any powdered sample.

The term “analyte” may refer to a substance whose physical and/orchemical constituents are to be analyzed, identified and/or measured.

The terms “assembly” or “subassembly” may be used interchangeably torefer to any portion of a device or system as may be indicated bycontext, and may refer to different portions of a device or system whenused in different contexts.

The term “vacuum” may refer to a pressure differential in a system or aportion of a system. The term “vacuum” may include a positive ornegative pressure differential. In some aspects, the term “vacuum” mayrefer to systems or portions of systems with an internal pressure lessthan or greater than atmospheric pressure.

The present disclosure generally relates to systems, devices and methodsfor analyzing and processing samples. The disclosed systems may includemodular aspects that permit the systems to be configured to analyze orprocess different types of samples, which may referred to as analytes.Additionally or alternatively, the systems may include modular aspectsto permit the systems to be configured to analyze or process samples byone or more different methods or techniques. Information about thesamples may be obtained through a variety of analysis techniques such asmicroscopy, spectroscopy, spectrometry, chromatography, as well as manyothers. Information about the samples may be used to conductexperiments; improve, control, or monitor production processes; orimprove, control, or monitor manufactured products.

In some configurations, the disclosed systems may be used in a labsetting to conduct experiments. For example, the configuration of thesystems may be selected for powders, liquids, gases, emulsions,suspensions, solids, homogeneous combinations, heterogeneouscombinations, pills, tablets, materials, biological samples, and/or anysuitable combinations thereof.

In other configurations, the disclosed systems may be used as a part ofproduction line to analyze and process samples to obtain informationabout aspects of the production line, such as characteristics offinished products and/or of intermediaries of the products. Thedisclosed systems may be implemented as in-process monitoring systemsintegrated into a production line and configured to analyze one or moreproperties of a sample as it is being produced.

FIG. 1 is a schematic diagram of an example embodiment of a system 10that may be configured to analyze or process samples. The system 10 mayinclude an objective 12 optically coupled to an optical multiplexer 14.The optical multiplexer 14 may be optically coupled to a sensor 16, anemitter 18 and/or a detector 20. A sample 34 may be positioned on and/orover a window 30 that is optically coupled to the objective 12 and/orthe optical multiplexer 14. The system 10 may include a platform 22 thatmay be configured to move portions of the system 10 relative to thesample 34. In some configurations, the platform 22 may be configured tomove portions of the system 10 in three directions of movement (linear,non-linear, angular, etc.). At least some portions of the system 10 canbe translated in any of the three directions relative to the sample 34.In operation, the movement of the platform 22 may contribute to focusingoptical components of the system 10, scanning the sample 34, engaging ordisengaging portions of the system 10, and/or a combination thereof.

The emitter 18 may be configured to emit radiation to analyze the sample34. The emitter may emit any suitable electromagnetic radiation toanalyze and/or process the sample 34. For example, the emitter 18 mayemit visible light, ultraviolet light, X-rays, infrared or any othersuitable radiation. In some configurations, the emitter 18 may be alaser or diode. In some configurations, the emitter 18 may be a Ramanlaser source. In some configurations, the emitter 18 may be opticallycoupled to an optically fiber to transmit and/or guide electromagneticradiation toward the sample 34.

The detector 20 may be configured to detect radiation from the sample34. For example, the detector 20 may be configured to detect radiationfrom the sample 34 resulting from the radiation from the emitter 18incidenting the sample 34. The detected radiation may permit informationregarding the sample 34 to be obtained. In some configurations, thedetector 20 may be a Raman spectrometer. In some configurations, thedetector 20 may be optically coupled to an optically fiber to transmitand/or guide electromagnetic radiation from the sample 34 to thedetector 20.

An emitter 32 may be positioned around the window 30 and/or proximatethe sample 34 and configured to emit radiation that may incident thesample 34. In some configurations, the emitter 32 may be a ringencircling the window 30. In other configurations, the emitter 32 may beone or more discrete emitter elements positioned at various suitablepositions with respect to the window 30 and/or the sample 34. In someconfigurations, the emitter 32 may be an electromagnetic radiationsource or an electromagnetic radiation ring.

In some configurations, the system 10 may include a controller 28configured to control the operation of at least a portion of the system10. The controller 28 may include a processor 24 that executesinstructions stored in memory 26. The processor 24 and memory 26 can beincorporated into the system 10, as illustrated. In otherconfigurations, the processor 24 and/or the memory 26 can be located ina controller 28 external to the system 10. For example, the system 10may be controlled and/or operated by a computer system coupled to thesystem 10.

The memory 26 can include executable instructions that control theoperation of the system 10. For example, the memory 26 can compriseinstructions that when executed by the processor 24 causes the emitter32 to expose the sample 34 to emitted radiation (e.g., electromagnetic,visible light, ultraviolet, heat, microwave, or other radiation).Depending on the properties of the sample 34 and the characteristics ofthe emitted radiation, some of the radiation projected on the sample 34may pass through the sample 34, some may be absorbed by the sample 34,and/or some may be reflected by the sample 34.

Emissions from the irradiated sample 34 (for example, by reflection orfluorescence), may travel through the objective 12 into the opticalmultiplexer 14. At least a part of the emissions from the sample 34 maybe directed to the sensor 16 by the optical multiplexer 14. The sensor16 may detect characteristics of the received radiation, such as energylevel, wavelength, or other characteristics. The characteristics of thereceived radiation may be used to determine characteristics of thesample 34. For example, in some configurations, the characteristics ofthe received radiation may be used to determine aspects of the sample34.

The system 10 may be configured to use the sensor 16 to obtaininformation about the sample 34. For example, the sensor 16 may be animage sensor (e.g., a color camera, or monochromatic camera) configuredto obtain images of the irradiated sample 34. The controller 28 may beconfigured to receive, process, modulate, and/or convert signals fromthe sensor 16 to obtain information about the sample 34. In someconfigurations, the controller 28 may be configured to generate imagesof the sample 34 from the signals from the sensor 16. The controller 28can employ image analyzing algorithms to: (i) compare particle luminancemagnitude of the sample 34; (ii) detect particle sizes of the sample 34;(iii) compare particle sizes against other sizes in the sample 34 or toa database of particle sizes; (iv) compare particle sizes against othershapes in the sample 34 or to databases of particle shapes, and/or anysuitable combinations of these algorithms or others.

In some configurations, the emitter 32 emits electromagnetic radiationat a given wavelength of a plurality of wavelengths into the sample 34.The emitter 32 may include, for example, one or more emitters capable ofproducing electromagnetic radiation within a terahertz range. In anotherexample, a wavelength of the electromagnetic radiation may be within arange of approximately 0.01 to 10 nanometers. This range comprises X-raywavelengths. In yet another example, the electromagnetic radiationproduced by the emitter 32 may be varied in wavelength from blue toultraviolet light. In another example, the emitter 32 emits white light.The responsiveness of the sample 34 is determined by the controller 28by examining color of the one or more of the components of the sample34.

The emitter 32 may be multiple sources that each provides a uniquenarrow band wavelength of electromagnetic radiation. For example, eachof the emitters 32 may output any of red, blue, and green light. Theemitters 32 may include light emitting diodes and/or lasers.

In yet other configuration, the emitter 32 may expose the mixture sampleto near infrared or mid infrared light. The emitters 32 may producebroad band radiation or successive bursts of narrow bands of radiation.In one example, the emitters 32 may selectively expose the mixturesample to many different wavelengths of electromagnetic radiation andanalyzing how each wavelength affects components of the sample 34. Thisexample configuration may be used to analyze samples of unknowncomposition, although other configurations are contemplated.

The objective 12 may include a high, low, or variable magnificationobjective lens. The objective 12 may include a high magnification lensthat permits viewing of small particles (e.g., less than 20 microns insize) and/or viewing small features on larger particles. The objective12 may include low magnification lenses used to provide a large field ofview, which may permit rapid identification of regions of interest in animage. The magnification of the objective 12 may be selectively variedby the controller 28 to locate particles at low power settings. Thecontroller 28 may be configured execute analytical processes to identifythe particle by shape and/or size. The controller 28 may be configuredto zoom in where particles of certain characteristics are identified.

In some configurations, an optical filter may be optically coupled priorto the sensor 16 to block frequencies of radiation that may damage thesensor 16 and/or provide undesired effects on the information obtainedby the sensor 16. In some configurations, the optical filter may beselected depending on the wavelength of the electromagnetic radiationthat is output by the emitter 32. In some configurations, the opticalfilter may be configured to block light at wavelengths of approximately425 nanometers to 700 nanometers. In other configurations, higherwavelength filters may be used in combination with lower wavelengthfilters. For example, higher wavelength filters may be used, forexample, with Raman lasers, while lower wavelength filters may be usedwith, for example, ultraviolet light. In some configurations, theemitter 32 may be a laser optically coupled with a long pass filter. Inanother example, the emitter 32 may be a light emitting diode (LED)optically coupled to a long pass filter.

The system 10 may include one or more optical filters used to block theexcitation wavelength for the sensor 16 to permit the sensor 16 toobtain usable images. The controller 28 may be configured to activatethe emitter 32 for a set period of time, such as ten seconds. Images maybe captured of the sample 34 by the sensor 16 to determine theresponsiveness of at least portions of the sample 34 by detecting timingand decay of response of the one or more of the components of the sample34 to the radiation.

The system 10 may use additional measurement algorithms to detect anddifferentiate components of the sample 34 from one another usingparticle size and shape. For example, the controller 28 of the system 40can use various image processing methods to determine an aspect ratiofor particles of components of the sample 34. Also, the controller 28 ofthe system 10 can calculate size, shape, fuzziness, angularity,brightness, and combinations thereof for components of the sample 34.

The size and/or shape of components of the sample 34 may be used todetect the presence of paper fibers or other contaminates. For example,if a particle is detected, its size and shape may be calculated usingimage processing. The size and shape may be compared to a database ofparticle sizes and corresponding shapes. If no reasonable comparison isfound, a particle may be determined to be a contaminate. Contaminatesmay be catalogued and/or stored in a database. In some configurations ofthe system 10, contaminants may be isolated, concentrated, separated,stored, and/or disposed. The algorithm used by the controller 28 may beselected based on the composition of the sample 34, if an expectedcomposition for the sample 34 is known.

With continued reference to FIG. 1, the emitter 32 may emitelectromagnetic radiation into the mixture sample at an angle B that isspecified with reference to a central axis C of the window 30. In suchconfigurations, radiation may enter the sample 34 at the angle B.

The controller 28 may be configured to detect, track and/or count anumber of excited particles in the sample 34. The controller 28 may befurther configured to calculate a concentration of a selected componentof the sample 34. For example, when the controller 28 has located anumber of a first component of the sample 34, the controller 28 maycalculate a volume of the first component of the sample 34, for example,using image analysis. The overall area of the particles of the firstcomponent relative to the total area of the image may be used toestimate the volume by weight of the first component, if the size of thefirst component particles is known.

In some configurations, Raman spectroscopy may be used to verify and/oranalyze the presence, size, and/or shape of components of the sample 34.In such configurations, the emitter 18 may be a Raman laser source andthe detector 20 may be a Raman spectrometer. The emitter 18 may becontrolled, for example, by the controller 28 to expose the sample 34 toa wavelength of laser light. The laser light may be focused onto a smallportion of the sample 34 where candidate particles are fluorescing(e.g., responsive). Images may be transferred by the optical multiplexer14 to the Raman spectrometer detector 20 via a Raman spectrometerinterface. The Raman spectrometer detector 20 and or the Ramanspectrometer interface may be integrated into the system 10 or may be astandalone external feature. In some circumstances, the identificationof the candidate particles may be confirmed using Raman spectroscopy.

In other configurations, the emitter 18 may instead be an X-ray source,near infrared source, infrared source, ultra violet source, and/or anysource of radiation suitable for an intended application. The system 10may include any suitable combinations or permutations of these or otherradiation sources, depending on the type of analytes being analyzedand/or the desired information to be obtained.

In some configurations, the system 10 may be used to obtainthree-dimensional models of the sample 34. A three dimensional model maybe a composition of many images obtained using permutations of positionsin three axes X, Y, and Z. For example, the objective 12 may be moved inthree directions of movement along three axes X, Y, and Z by theplatform 22. The Z-axis may be aligned with the central axis C of thewindow 30. Depending on the width of the field of view of the sensor 16,the objective 12 may be moved sequentially along the window 30 in the Xand Y direction. At each X and Y location, the platform 22 may translatethe objective 12 from an initial position along the Z-axis towards thewindow 30, in increments (e.g., one micron increments, etc.). At eachincrement, the sensor 16 may obtain an image of the illuminated sample34. The system 10 may be capable of obtaining images at any given depthinto the sample 34. These images may each be associated with theirrespective X, Y, and Z location information. The images may be assembledtogether by the system 10, for example via the controller 28, to form athree-dimensional model of the sample 34.

The three-dimensional imaging of the sample 34 may be used to calculateresponsive particles of a component of the sample 34 on a surface of thesample 34, as well as particles located within the sample 34 at aspecified distance inside the surface of the sample 34.

A method of analyzing the sample 34 using the system 10 will bedescribed in further detail. The method may include capturing highresolution color images of the sample 34 exposed with multiple colorlighting (e.g., a range of wavelengths of electromagnetic radiation).The multiple color lighting of the sample 34 may occur at multipleangles of incidence and/or from different directions. For example, theangle B may be selectively varied during illumination of the sample 34.The method may include processing the images to identify possibleparticles of a first component of the sample 34 by size, color, and/orshape. The method may include using Raman scanning and analysis topositively identify candidate particles as particles of the firstcomponent. This may be accomplished using a Raman signature forparticles of the first component as a baseline. The method may includecalculating a particle area to percentage-by-weight calculation where apercentage-by-weight is correlated to a percentage-by-area of particlesof the first component observed in the images. The method may berepeated until a statistically significant particle area is located inone or more components of the sample 34 and/or multiple samples.

The system 10 may include any suitable aspects described in U.S. patentapplication Ser. No. 14/507,637, entitled “OPTICAL AND CHEMICALANALYTICAL SYSTEMS AND METHODS” and U.S. patent application Ser. No.14/454,483, entitled “ANALYSIS AND PURGING OF MATERIALS IN MANUFACTURINGPROCESSES,” which are both incorporated herein by reference in theirentirety and for all purposes. The concepts described with respect tothe system 10 may be implemented in a variety of configurations and maybe combined with other aspects of this disclosure, as may be indicatedby context.

Turning to FIGS. 2A-2E, an example embodiment of a system 40 that can beconfigured to analyze or process samples will be described. In someconfigurations, the system 40 may be an implementation of the system 10of FIG. 1. Accordingly, the system 40 may include any suitable aspectsdescribed with respect to system 10, as may be indicated by context.

FIGS. 2A and 2B are perspective views of a portion of the system 40. Asillustrated, the system 40 may include a housing 42 surrounding at leasta portion of the system 40. The system 40 may include an interfaceassembly 80 configured to interface with other portions of the system40, as will be described in further detail below. The interface assembly80 may include a body 82 and a window 84 that is configured to permitlight to travel through at least a portion of the interface assembly 80.The window 84 may be at least partially transparent or translucentand/or may be configured to convey, direct, collimate and/or focus lighttravelling through the interface assembly 80. In the illustratedconfiguration, the interface assembly 80 is positioned on a top portionof the housing 42, although other suitable configurations arecontemplated.

Turning to FIG. 2B, the system 40 may include a first connector 44, asecond connector 46, and a third connector 48 connecting portions of thesystem 40 inside of the housing 42 to portions of the system 40 exteriorto the housing 42. The connectors 44, 46, and 48 may be electronicconnectors configured to transmit data, power and/or control signals.The system 40 may include a switch 52 that may be configured to activateand/or turn on at least portions of the system 40.

As illustrated, the first connector 44 may be a socket configured toreceive a first plug to electrically couple the system 40 and the secondconnector 46 may be a socket configured to receive a second plug toelectrically couple the system 40. The first connector 44 may permit thesystem 40 to be electrically coupled to a power source, for example, analternating current (AC) power supply. The second connector 46 may be asocket configured to transmit data, power and/or control signals inand/or out of portions of the system 40 inside of the housing 42.

As illustrated, the third connector 48 may be a cable connector coupledwith the housing 42 by a connector panel 50. In the illustratedconfiguration, the third connector 48 is a Universal Serial Bus (USB)cable extending from the system 40. In such configurations, the thirdconnector 48 may transmit one or more of data, power and/or controlsignals. In other configurations, the third connector 48 may be anysuitable connector that may or may not correspond to an interfacestandard or interface protocol (such as USB, firewire, etc.). Theconnector panel 50 may include a connector 51 which may be, for example,a fluid connector or a vacuum connector.

In some configurations, the third connector 48 may permit the system 40to be coupled to electronic components such as computers, computersystems, computer interfaces, user interfaces, mobile devices and/or anyother suitable electronic component. In such configurations, theelectronic component may provide power and/or control signals to thesystem 40 via the third connector 48. Additionally or alternatively, theelectronic component may receive data signals and/or feedback from thesystem 40 via the third connector 48. In other configurations, the thirdconnector 48 may permit the system 40 to be coupled to other componentsof the system 40. In such configurations, portions of the system 40 (forexample, portions inside of the housing 42) may provide power and/orcontrol signals to at least one other component of the system 40 via thethird connector 48. Additionally or alternatively, portions of thesystem 40 (for example, portions inside of the housing 42) may receivedata signals and/or feedback from at least one other component of thesystem 40 via the third connector 48. The connector panel 50 may beremovably coupled to the housing 42 to permit connectors of differenttypes to be coupled to the system 40.

In some configurations, the system 40 may include non-illustratedconnectors such as a fluid connector configured to permit fluid(gaseous, liquid, or otherwise) to travel into or out of the housing 42.Fluid connectors may permit the system 40 to be coupled with, forexample, vacuum lines, pressurized gas lines, cooling fluid lines, waterlines, liquid lines, or other suitable fluids. Although the illustratedconfiguration includes three connectors 44, 46, and 48, the system 40may include any suitable amount of connectors and may include connectorsof any suitable type. The configurations of the connectors may beselected based on the desired configuration and/or functionality of thesystem 40, as applicable. Additionally or alternatively, theconfiguration of the connectors may be selected depending on modularcomponents that may be coupled, added and/or activated with the system40.

The system 40 may include a security assembly 54 that may be configuredto lock the system 40 from being operated. For example, the securityassembly 54 may disable portions of the system 40 such as emitters fromoperating to facilitate in preventing inadvertent exposure toelectromagnetic radiation. In some configurations, the security assembly54 may disconnect power from one or more emitters of the system 40. Thesecurity assembly 54 may facilitate in preventing operation of thesystem 40 in a potentially unsafe manner and/or may facilitate inpreventing inadvertent exposure to electromagnetic radiation when thesystem 40 is being serviced. In the illustrated configuration, thesecurity assembly 54 is a key and a lock configured to receive the key.In other configurations, the security assembly 54 may include anysuitable electronic and/or mechanical locking mechanism. For example,biometric and/or cryptographic key locking mechanisms (password, passphrase, personal identification number, etc.) may be employed. Thesecurity assembly 54 may facilitate safe operation of the system 40 bypermitting only qualified users to operate the system 40.

The system 40 may include a temperature management assembly 56configured to facilitate temperature control of at least a portion ofthe system 40. For example, the temperature management assembly 56 mayheat or cool portions of the system 40, such as those positioned withinthe housing 42, to maintain desired or suitable operating conditions. Asillustrated for example in FIG. 2E, in some configurations thetemperature management assembly 56 may include a heat sink 36 positionedbetween a first ventilator 38 and a second ventilator 58. The heat sink36 may be configured to transmit heat by conduction and maintainseparation between the interior and the exterior of the housing 42. Thefirst ventilator 38 and second ventilator 58 may be configured to driveair and/or other fluids along the surfaces of the heat sink 36 tofacilitate heat management. In other configurations, the temperaturemanagement assembly 56 may include any suitable heating and/or coolingmechanisms.

Although in the illustrated configuration components of the system 40such as the switch 52, the security assembly 54, the temperaturemanagement assembly 56, and the connectors 44, 46, 48 are positioned onone end of the housing 42, such components may be positioned at anysuitable position in the system 40. In some configurations, at least oneof the components may be positioned, for example, inside of the housing.

FIGS. 2C, 2D, and 2E illustrate portions of the system 40 inside of thehousing 42, which is represented by dashed lines. As illustrated, thesystem 40 may include a head assembly 70, a power assembly 60, anemitter assembly 62, a detector assembly 64, and an electronic assembly66 positioned inside of the housing 42. The head assembly 70 may bemechanically coupled to the interface assembly 80 and/or opticallycoupled to receive and/or transmit electromagnetic radiation to/from theinterface assembly 80. The head assembly 70 is omitted from FIG. 2E toillustrate other portions of the system 40.

The power assembly 60 may be configured to control, distribute and/ormodulate power supplied to portions of the system 40. In someconfigurations, the power assembly 60 may be electrically coupled withvarious portions of the system 40 by electrical couplings such as cables(not illustrated).

The emitter assembly 62 may include an emitter such as the emitter 18and the detector assembly 64 may include a detector such as detector 20as described with respect to FIG. 1. The emitter assembly 62 may includea first interface 72 and the detector assembly 64 may include a secondinterface 74. In some configurations, the first and second interfaces72, 74 may be optical interfaces configured to optically couple theemitter assembly 62 and/or the detector assembly 64. For example, thefirst interface 72 may optically couple the emitter assembly 62 to thehead assembly 70 via, for example, an optical cable (not illustrated).In another example, the second interface 74 may optically couple thedetector assembly 64 to the head assembly 70 via, for example, anoptical cable (not illustrated). The emitter assembly 62 may beconfigured to transmit radiation to the head assembly 70 and/or thedetector assembly 64 may be configured to receive radiation from thehead assembly 70 to obtain information about samples. In someconfigurations, the emitter assembly 62 may be a Raman laser sourceassembly and the detector 20 may be a Raman spectrometer assembly.

In some configurations, portions of the system 40 may be opticallycoupled to one another with optical fibers configured to transmitelectromagnetic radiation between different portions of the system 40.

In an example implementation, the head assembly 70 may include anobjective, an optical multiplexer, a sensor and/or platform such as theobjective 12, the optical multiplexer 14, the sensor 16, and/or platform22 as described with respect to FIG. 1. Additionally or alternatively,the head assembly 70 may include a controller such as controller 28 asdescribed with respect to FIG. 1. The head assembly 70 will be describedin further detail below with respect to FIGS. 3A-3F.

The electronic assembly 66 may be configured to distribute data, powerand/or control signals to various portions of the system 40. Theelectronic assembly 66 may include one or more connectors 76, 78configured to couple various components of the system 40. In someconfigurations, the electronic assembly 66 may be a USB hub.

FIGS. 3A-3D illustrate perspective views of an example implementation ofthe head assembly, denoted generally at 70. FIGS. 3E and 3F illustratethe head assembly 70 with some portions omitted to illustrate otherdetails of the head assembly 70. As illustrated, the head assembly 70may be optically coupled to receive and/or transmit electromagneticradiation to/from the interface assembly 80. Specifically, the headassembly 70 may include an objective 102 (see for example FIGS. 3E and3F) coupled to the interface assembly 80. The objective 102 may includeoptics configured to convey, direct, collimate and/or focuselectromagnetic radiation travelling between the head assembly 70 andthe interface assembly 80. As illustrated for example in FIG. 3F, theobjective 102 may be optically coupled to an optical multiplexer 104.The optical multiplexer 104 may be configured to distributeelectromagnetic radiation travelling through the head assembly 70 and/orother portions of the system 40. Additionally or alternatively, theoptical multiplexer 104 may be configured to convey, direct, collimateand/or focus electromagnetic radiation travelling through the headassembly 70 and/or other portions of the system 40.

The head assembly 70 may include a sensor 106 configured to detectcharacteristics of received electromagnetic radiation such as energylevel, wavelength, or other characteristics (for example, as describedabove with respect to the system 10). The characteristics of thereceived radiation may be used to determine characteristics of samples.In some configurations, the sensor 106 may be an image sensor (e.g., acolor camera, or monochromatic camera) configured to obtain images ofsamples. An optical assembly 108 may be optically coupled between theoptical multiplexer 104 and the sensor 106. The optical assembly 108 maybe configured to convey, direct, collimate and/or focus electromagneticradiation travelling between the optical multiplexer 104 and the sensor106. The sensor 106 may include a first connector 110 and/or a secondconnector 112 configured to transmit data, power and/or control signalsbetween the sensor 106 and other portions of the head assembly 70.

The head assembly 70 may be configured such that portions of the headassembly 70 may be moved with respect to the interface assembly 80. Forexample, in some configurations, the head assembly 70 may move at leastthe objective 102 with respect to the interface assembly 80. In someconfigurations, the head assembly 70 may be configured to move portionsof the head assembly 70 in three directions of movement (linear,non-linear, angular, etc.), for example, along three axes: X, Y, and Z.In operation, the movement of portions of the head assembly 70 such asthe objective 102 may contribute to focusing and/or scanning thesamples.

As illustrated for example in FIG. 3E, the head assembly 70 may includeone or more motors or actuators 160, 170, 180. Each of the actuators160, 170, 180 may be coupled to a corresponding slide 162, 172, 172configured to the permit portions of the head assembly 70 (e.g., theobjective 102) to move with respect to the interface assembly 80. In theillustrated configuration, each actuator 160, 170, 180 and slide 162,172, 172 corresponds to a direction of movement X, Y, and Z. Innon-illustrated configurations, the head assembly 70 may include less ormore directions of movement, and/or such directions may or may not beorthogonal to one another. Each of the actuators 160, 170, 180 mayinclude a corresponding connector 164, 174, and 184. The connectors 164,174, 184 may be configured to couple the actuators 160, 170, 180 toother portions of the head assembly 70. The connectors 164, 174, 184 maybe electronic connectors configured to transmit data, power and/orcontrol signals. The connectors 164, 174, 184 may transmit power and/orcontrol signals to drive and/or operate the actuators 160, 170, 180 tomove portions of the head assembly 70 with respect to the interfaceassembly 80. The head assembly 70 may include stops corresponding witheach of the directions of movement to limit the movement of the portionsof the head assembly 70 with respect to the interface assembly 80.

In the illustrated configuration, portions of the head assembly 70actuate in three linear directions of movement. In other configurations,the head assembly 70 may actuate in any suitable directions of movement,and such directions of movement may not be linear (e.g., rotational,angular, non-linear, etc.). In some configurations, the head assembly 70may include mirrors that may be rotated and/or actuated to deflectoptical beams rather than moving other portions of the head assembly 70.

The head assembly 70 may include an electronic assembly 114 with acontroller configured to control the operation of at least a portion ofthe system 10. The electronic assembly 114 may be configured todistribute power and/or control signals to other components of the headassembly 70. The electronic assembly 114 may be configured to receivedata signals from other components of the head assembly 70, such as thesensor 106.

Specifically, the electronic assembly 114 may include one or moreconnectors 116 configured to couple the electronic assembly 114 to otherportions of the head assembly 70. The connector 116 may be electronicconnector configured to transmit data, power and/or control signals. Theconnector 116 may be coupled to other portions of the head assembly 70,such as the sensor 106, the actuators 160, 170, 180 and/or othercomponents. Additionally or alternatively, the connector 116 may becoupled to other portions of the system 40.

The electronic assembly 114 may include a processor that executesinstructions stored in memory. As illustrated, the electronic assembly114 may be incorporated into the head assembly 70. In otherconfigurations, the electronic assembly 114 may be a separate componentexternal to the head assembly 70. For example, the head assembly 70 maybe controlled and/or operated by a computer system coupled to the headassembly 70. The electronic assembly 114 can include executableinstructions that control the operation of the head assembly 70. Forexample, the electronic assembly 114 can include instructions that whenexecuted cause the head assembly 70 to analyze and/or scan one or moresamples.

The head assembly 70 may include an electronic assembly 126, which insome configurations may be a temperature management assembly configuredto manage the temperature of portions of the head assembly 70. Forexample, the electronic assembly 126 may be configured to cool portionsof the head assembly 70. The electronic assembly 126 may include aPeltier device, Peltier heat pump, solid state refrigerator, and/or athermoelectric cooler. The electronic assembly 126 may include acontroller configured to manage the temperature of portions of the headassembly 70 by controlling the operation of a Peltier device, Peltierheat pump, solid state refrigerator, and/or a thermoelectric cooler.

As illustrated for example in FIG. 3F, the head assembly 70 may includean emitter 132 configured to emit radiation to analyze samples. Theemitter 132 may emit any suitable electromagnetic radiation to analyzeand/or process samples. For example, the emitter 132 may emit visiblelight, ultraviolet light, X-rays, infrared or any other suitableradiation. In some configurations, the emitter 132 may be a laser ordiode. In some configurations, the emitter 132 may be a Raman lasersource. As illustrated, the emitter 132 may be free-space opticallycoupled to other portions of the head assembly 70. The emitter 132 maybe optically coupled with the optical multiplexer 104. In suchconfigurations, the optical multiplexer 104 may be configured to convey,direct, collimate and/or focus electromagnetic radiation from theemitter 132. For example, the optical multiplexer 104 and/or otheroptical components may be configured to direct radiation from theemitter 132 to a sample, for example, through the window 84.

In addition to or as an alternative to the emitter 132, the headassembly 70 may include an optical interface 128 configured to opticallycouple the head assembly 70 to other components of the system 40. Forexample, the optical interface 128 may couple the head assembly 70 to anemitter, such as the emitter assembly 62 as described above with respectto FIGS. 2C and 2E. The optical interface 128 may optically couple thehead assembly 70 to the emitter assembly 62 via, for example, an opticalcable (not illustrated). The emitter assembly 62 may be configured totransmit electromagnetic radiation to the head assembly 70. In suchconfigurations, the optical multiplexer 104 may be configured to convey,direct, collimate and/or focus electromagnetic radiation from theemitter assembly 62. For example, the optical multiplexer 104 may beconfigured to direct radiation from the emitter assembly 62 to a sample.

For the sake of illustration, the system 40 includes multiple emitters,such as the emitter 132 and/or the emitter assembly 62. In otherimplementations, the system 40 may include either the emitter 132 or theemitter assembly 62, but not both. Such configurations may beimplemented when dual emitters of certain types may not be necessary ordesirable.

The head assembly 70 may include a second optical interface 130configured to optically couple the head assembly 70 to other componentsof the system 40. For example, the optical interface 130 may couple thehead assembly 70 to a detector, such as the detector assembly 64 asillustrated and described with respect to FIGS. 2C and 2E, for example.The optical interface 130 may optically couple the head assembly 70 tothe detector assembly 64 via, for example, an optical cable (notillustrated). The detector assembly 64 may be configured to receiveradiation from the head assembly 70 to obtain information about samples.In such configurations, the optical multiplexer 104 may be configured toconvey, direct, collimate and/or focus electromagnetic radiation to thedetector assembly 64. For example, the optical multiplexer 104 may beconfigured to distribute radiation from samples to the detector assembly64.

The head assembly 70 may include one or more support members 134, 136,138, 140 configured to support, enclose, and/or couple portions of thehead assembly 70 to one another. The configuration of the supportmembers 134, 136, 138, 140 may permit portions of the head assembly 70to move in the X, Y, and Z directions. Additionally or alternatively,the configuration of the support members 134, 136, 138, 140 may limitthe range of motion of portions of the head assembly 70 in the X, Y, andZ directions.

The head assembly 70 may include one or more heat sinks 120, 122, 124configured to facilitate cooling of portions of the head assembly 70. Insome configurations, the heat sinks 120, 122, 124 may be configured tocool specific components of the head assembly 70. For example, in theillustrated configuration, the heat sink 120 is configured to cool theemitter 132, the heat sink 122 is configured to cool the sensor 106 andthe heat sink 124 is configured to cool the electronic assembly 126 orother portions of the head assembly 70. In other configurations, thehead assembly 70 may include more or less heat sinks; the heat sinks120, 122, 124 may be configured in other manners; or may be omittedentirely. Additionally or alternatively, the temperature of thecomponents of the head assembly 70 may be managed by other temperaturecontrol systems and/or mechanisms.

In some configurations, the head assembly 70 may include any suitableaspects as described with respect to the system 10 of FIG. 1.

FIGS. 4A and 4B illustrate one example embodiment of the interfaceassembly, denoted generally at 80, in further detail. The interfaceassembly 80 may be configured to interface with other portions of thesystem 40, such as the head assembly 70 and/or other components of thesystem 40 that will be described in further detail below. Asillustrated, the body 82 of the interface assembly 80 defines anaperture 86 extending at least partially through the interface assembly80. The aperture 86 may be configured (e.g. shaped and/or dimensioned)to permit electromagnetic radiation to travel through at least a portionof the interface assembly 80 to the window 84. The window 84 may be atleast partially transparent or translucent and/or may be configured toconvey, direct, collimate and/or focus light travelling through theinterface assembly 80.

As illustrated for example in FIG. 4B, the body 82 of the interfaceassembly 80 may define a receptacle 88 with an optoelectronic assembly90 positioned therein. The optoelectronic assembly 90 will be describedin further detail below with respect to FIGS. 5A-5B. The optoelectronicassembly 90 may be removably or non-removably fastened to the body 82 ofthe interface assembly 80 inside of the receptacle 88. Theoptoelectronic assembly 90 may include a body 92 and a connector 94coupled to the body 92. In some configurations, the body 92 may be anelectronic board such as a printed circuit board (PCB). The connector 94may be configured to couple the optoelectronic assembly 90 to otherportions of the system 40. The body 92 may include an opening furtherdefining the aperture 86 of the interface assembly 80.

Turning to FIGS. 5A and 5B, the optoelectronic assembly 90 will bedescribed in further detail. As illustrated, the optoelectronic assembly90 may include one or more emitters 96 positioned around the aperture86. One or more polarizers 98 may be positioned between each of theemitter 96 and the aperture 86. The emitters 96 may be configured toemit visible light, ultraviolet light, X-rays, infrared or any othersuitable radiation. The emitter 96 may be any suitable electromagneticradiation source. In some configurations, the emitter 96 may be a laseror a diode. In some configurations, the optoelectronic assembly 90 mayinclude multiple emitters 96 and one or more of the emitters 96 may beconfigured to output electromagnetic radiation of differentcharacteristics from one another. The emitters 96 may be electricallycoupled to the connector 94 by any suitable electrical coupling. Forexample, the emitters 96 may be electrically coupled to the connector 94by conductive traces printed on the body 92 or running through the body92. The connector 94 may be coupled to other portions of the system 40.The connector 94 may permit power and/or control signals to betransmitted to the emitters 96. The connector 94 may also permitfeedback and/or data to be transmitted from the optoelectronic assembly90 to other portions of the system 40.

As illustrated for example in FIG. 5A, a heat conductive material 99 maybe coupled to the body 92. The heat conductive material 99 may beconfigured to facilitate managing the temperature of the optoelectronicassembly 90 and/or the interface assembly 80. For example, the heatconductive material 99 may permit heat to be dissipated from portions ofthe optoelectronic assembly 90 and/or the interface assembly 80.Specifically, heat generated during operation of the emitters 96 may beconducted through the heat conductive material 99 and may dissipate awayfrom the emitters 96. Additionally or alternatively, the heat conductivematerial 99 may dissipate heat from the polarizers 98 and/or otherportions of the interface assembly 80. In some configurations, the heatconductive material 99 may be copper or may at least partially includecopper.

FIG. 5C illustrates a cross-sectional view of the interface assembly 80with the optoelectronic assembly 90. In operation, a sample may bepositioned over the window 84 and the head assembly 70 may be activatedto analyze and/or process the sample. In some configurations, the window84 may be sealed to the body 82 such that substances may not travelbetween the window 84 and the body 82 at their interface. For example,the interface assembly 80 may include a seal such as an 0-ring betweenthe window 84 and the body 82. The window 84 and/or the aperture 86 maypermit light to travel through the interface assembly 80, for example,between the sample and the objective 102 of the head assembly 70. Theoptoelectronic assembly 90 may be coupled to the body 82 such that theobjective 102 of the head assembly 70 is a specified distance or rangeof distances from the optoelectronic assembly 90.

FIGS. 6A-6C illustrate the system 40 with different exampleconfigurations to process samples of different types and/or by differentmethods or techniques. FIG. 6A illustrates the system 40 with a device200 configured to analyze one or more samples positioned in a sampletray. FIG. 6B illustrates the system 40 with a device 300 configured toanalyze layers of samples, for example pills, tablets, capsules,medication, pellets, and/or other substances. FIG. 6C illustrates thesystem 40 with a device 400 configured to analyze particle samples suchas powders, granules, and/or other substances. The system 40 may also beconfigured to analyze fluid samples such as liquids, gels, gases, and/orother substances, for example, as described in further detail below withrespect to FIGS. 8A-8F. In such configurations, the system 40 mayinclude an interface assembly 80 adapted to receive, deliver, processand/or analyze liquids, gels, gases, and/or other substances.

As mentioned above, the system 40 may be modular to permit the system 40to be configured to analyze or process different types of samples.Additionally or alternatively, the system 40 may be modular to permitthe system 40 to be configured to analyze or process samples by one ormore different methods or techniques. Specifically, the interfaceassembly 80 may interface with modular components and/or devices. Themodular components and/or devices may be configured to process, prepareand/or deliver analytes or samples over the window 84 to be analyzed bythe system 40. The modular components and/or devices may includeconfigurations suited for processing a specific type of sample oranalyzing samples by a specific method or process. Additionally oralternatively, the modular components and/or devices may be configuredto process samples either before or after they are analyzed, or both.For example, the modular components and/or devices may prepare thesamples to be analyzed by the system 40. In another example, the modularcomponents and/or devices may sort and/or separate samples after thesamples are analyzed, for example, based on information obtained whenthe samples were analyzed.

Turning to FIGS. 7A-7D, the device 200 will be described in furtherdetail. FIG. 7A illustrates a perspective view of the device 200. Asillustrated, the device 200 may include a tray holder 208 configured toreceive a sample tray 204. The sample tray 204 may include one or morewells 206 configured to receive a sample. The sample tray 204 may beconfigured to permit electromagnetic radiation to travel through thesample tray 204 to samples positioned inside of the wells 206. Forexample, at least a portion of the sample tray 204 may be at leastpartially transparent or translucent. In the illustrated configuration,the sample tray 204 includes ninety-six (96) of the wells 206, althoughonly one is labeled in the Figures for clarity. In some configurations,the tray holder 208 may receive sample trays with a standardizedconfiguration (e.g., shape, dimensions, number of wells, etc.).

The sample tray 204 may be removably positioned inside of the trayholder 208 so one or more samples may be analyzed by the system 40. Inthe illustrated configuration, the device 200 is configured to move thesample tray 204 along two axes C and D. The device 200 may move thesample tray 204 along the axes C and D so that each of the wells 206 maybe analyzed, as will be described in further detail below. In otherconfigurations, the device 200 may be configured to move the sample tray204 along more or less than the two axes C and D, and such axes may ormay not be orthogonal to one another.

The device 200 may include a housing 202 surrounding at least a portionof the device 200. The tray holder 208 may be coupled to or integrallyformed with a first member 214 that may be configured to move withrespect to the housing 202 along axis C. The first member 214 may bemovably and/or slidingly coupled to a second member 216 that may beconfigured to move with respect to the housing 202 along axis D. Theconfiguration of the first member 214 and the second member 216 maypermit the sample tray 204 to be moved along one or both of the axes Cand D.

FIG. 7B illustrates a perspective view of the device 200 with thehousing 202 not shown. As illustrated for example in FIG. 7B, the device200 may include one or more linear actuators or motors 260, 270. If themotors 260, 270 are rotational motors, each of the motors 260, 270 maybe coupled to a corresponding lead screw 262, 272 configured totranslate rotational motion to linear motion. If the motors 260, 270 areconfigured to convey linear motion, the lead screws 262, 272 may beshafts, coupling members, and/or omitted altogether. As illustrated, thelead screw 272 may be coupled to the first member 214 such that themotor 270 can drive the first member 214 along the axis C. The leadscrew 262 may be coupled to the second member 216 such that the motor260 can drive the second member 216 along the axis D.

The device 200 may include an electronic assembly 210 with one or moreconnectors 212. The electronic assembly 210 may include a controllerconfigured to control the operation of at least a portion of the device200. The connector 212 may be an electronic connector configured totransmit data, power, feedback and/or control signals. In someconfigurations, the connector 212 may be coupled to the connector 46and/or the connector 48 of the system 40. The electronic assembly 210may include connectors electrically coupled to corresponding connectorsof the motors 260, 270 (not illustrated). The electronic assembly 210may be configured to distribute power and/or control signals to othercomponents of the device 200, such as the motors 260, 270. Theelectronic assembly 210 may be configured to receive data signals and/orfeedback from the motors 260, 270. The electronic assembly 210 may beconfigured to receive power and/or control signals from other portionsof the system 40, and/or may distribute such power and/or controlsignals to portions of the device 200.

The device 200 may include stops corresponding with each axis ofmovement to limit the movement of portions of the device 200 such as thefirst member 214, the second member 216, the tray holder 208 and/or thesample tray 204.

The electronic assembly 210 may include a processor that executesinstructions stored in memory. As illustrated, the electronic assembly210 may be incorporated into the device 200. In other configurations,the electronic assembly 210 may be positioned as a separate componentexternal to the device 200. For example, the device 200 may becontrolled and/or operated by a computer system coupled to the device200. The electronic assembly 210 can include executable instructionsthat control the operation of the device 200. For example, theelectronic assembly 210 can include instructions that when executedcause the device 200 to move the tray holder 208 and/or the sample tray204 to analyze and/or scan one or more samples positioned inside of thewells 206. In some configurations, the samples may be analyzed and/orscanned individually. In other configurations, samples inside of morethan one of the wells 206 may be analyzed simultaneously.

FIG. 7C illustrates a bottom perspective view and FIG. 7D illustrates atop view of the device 200. As illustrated, the device 200 may becoupled to an objective such as the objective 102 of the head assembly70. The objective 102 may include any of the features described withrespect to the objective 102 of the head assembly 70 and/or may beadapted to operate with the device 200. As illustrated, when the device200 is included in the system 40, interface assemblies such as theinterface assembly 80 may be omitted and the device 200 may be directlyoptically coupled to the objective 102 of the head assembly 70. In otherconfigurations, interface assemblies such as the interface assembly 80may be included between the objective 102 and the device 200.

The objective 102 may be configured to analyze and/or process samples inthe wells 206 of the sample tray 204. Specifically, the objective 102may be configured to transmit and/or receive electromagnetic radiationtravelling between the head assembly 70 and samples positioned inside ofthe wells 206 of the sample tray 204. The sample tray 204 may be movedin the C and/or D directions with respect to the objective 102 to changewhich of the wells 206 of the sample tray 204 are being scanned and/oranalyzed. Additionally or alternatively, the movement of the sample tray204 in the C and/or D directions may contribute to the scanning and/oranalyzing of the samples by the head assembly 70.

In addition to or as an alternative to the movement of the sample tray204, the objective 102 may be moved in the Z and or X directions (seefor example FIG. 3C) by the head assembly 70 to scan and/or analyzesamples inside of one or more wells 206 of the sample tray 204. Theobjective 102 may be moved in the Y direction (see for example FIG. 3C)by the head assembly 70 to focus electromagnetic radiation travellingbetween the head assembly 70 and samples positioned inside of the wells206.

In some configurations, the device 200 may include an enclosure (notillustrated) covering at least a portion of the device 200. Theenclosure may include an open and a closed position. In the closedposition, the enclosure may at least partially or entirely isolate thedevice 200 from electromagnetic radiation external to the system 40. Forexample, the enclosure may block light external to the system 40.

In further configurations, the device 200 may include one or moreemitters configured to emit radiation incidenting the sample tray 204and/or the samples in the wells 206. For example, the emitters may beincluded with the enclosure and/or the tray holder 208. Additionally oralternatively, emitters may be coupled to and/or positioned around theobjective 102. The emitters may include any suitable aspects of any ofthe emitters described in this disclosure.

In further configurations, the device 200 may be environmentallycontrolled. For example, the temperature, pressure, and/or othercharacteristics surrounding the sample tray 204 and/or the samples inthe wells 206 may be controlled. Such configurations may be used toanalyze organic matter (e.g., cells, proteins, etc.) without damagingthe analytes.

FIGS. 8A-8D illustrate a sample positioned on the window 84. FIGS. 8A-8Dmay be visual representations of data obtained during analysis and/orprocessing of a sample by the head assembly 70. Additionally oralternatively, FIGS. 8A-8D may represent visible light images of asample on the window 84. Additionally or alternatively, FIGS. 8A-8D mayrepresent data obtained by way of imaging by electromagnetic radiationthat is different than visible light radiation. With attention to FIGS.8A-8D, a method of analyzing and/or processing a sample will bedescribed in further detail.

As illustrated in FIG. 8A, a sample may include a plurality ofparticles. In some circumstances, the particles may include differentcharacteristics from one another. For example, the particles may includedifferent dimensions, shapes, chemical composition, etc. Data obtainedduring analysis of the sample may be used to distinguish differentparticles based on their characteristics. The data may be used toidentify various components of the sample. In some circumstances, thesample may include contaminants that may be identified based on thedata.

A method of analyzing and/or processing a sample may include scanningthe sample using a first scanning method with a first electromagneticradiation. In some configurations, the first electromagnetic radiationmay be visible light resulting in analyzed data representing an image.FIG. 8A illustrates a representation of a sample with the first particle470 that may be obtained using the first scanning method with the firstelectromagnetic radiation. The particle 470 may be any component of asample, but in some circumstances the particle 470 may represent acontaminant or area of interest of a sample. Using the data obtained bythe first scanning method with the first electromagnetic radiation, oneor more contaminants and/or areas of interest of a sample may beidentified. Identification may include the position and/or othercharacteristics of the contaminants and/or areas of interest.

After the contaminants and/or areas of interest (e.g., the particle 470,etc.) are identified, a second scanning method with a secondelectromagnetic radiation may be used to analyze and/or process thesample. In some configurations, the second scanning method may be Ramanspectroscopy.

The second scanning method with the second electromagnetic radiation maybe configured based on data obtained by the first scanning method withthe first electromagnetic radiation. For example, as represented in FIG.8B, the second scanning method may be configured such that certainportions of the sample (e.g., the particle 470, etc.) are not scanned.The portions of the sample that are not scanned may correspond withcontaminants and/or areas of interest.

Additionally or alternatively, as represented in FIG. 8C, the secondscanning method may be configured such that only certain portions of thesample (e.g., the particle 470, etc.) are scanned. The portions of thesample that are scanned may correspond with contaminants and/or areas ofinterest. The second scanning method may alter and/or modulate thecharacteristics of the sample. For example, the second electromagneticradiation may burn or otherwise alter contaminants such as the particle470.

Additionally or alternatively, as represented in FIG. 8D, the secondscanning method may be configured such that certain portions of thesample (e.g., the particle 470, etc.) are scanned with electromagneticradiation with different characteristics.

In some configurations, a method of analyzing and/or processing a samplemay include imaging a sample with electromagnetic radiation such asvisible light and/or ultraviolet light. The method of analyzing and/orprocessing the sample may include analyzing the sample with Ramanspectroscopy after imaging the sample. The method of analyzing and/orprocessing the sample may include configuring the Raman spectroscopyanalyzation after imaging the sample and/or before Raman spectroscopyanalyzation. Configuring the Raman spectroscopy analyzation may includeidentifying contaminants and/or areas of interest based on data obtainedfrom imaging the sample. Configuring the Raman spectroscopy analyzationmay include selecting portions of the sample to be analyzed by Ramanspectroscopy and/or selecting portions of the sample not to be analyzedby Raman spectroscopy. Configuring the Raman spectroscopy analyzationmay include selecting first portions of the sample to be analyzed byRaman spectroscopy of a first characteristic (e.g., power level,resolution, etc.) and/or selecting second portions of the sampledifferent than the first portions to be analyzed by Raman spectroscopyof a second characteristic (e.g., power level, resolution, etc.). Themethod of analyzing and/or processing the sample may include analyzingthe sample with Raman spectroscopy based on the configuration of theRaman spectroscopy analyzation.

In some configurations, a sample may include organic matter such ascells. In some circumstances, a sample may include cells overlapping oneanother with respect to the window 84. In some circumstances, theoverlapping cells may inhibit analyzing and/or processing the sample atthe overlapping portion. One or more overlapping portions of cells maybe identified, for example, using visible light, ultraviolet lightand/or other analyzation methods. One or more overlapping portions maybe selected not to be scanned as illustrated and described with respectto FIG. 8B. Specifically, the overlapping portions may not be scannedbecause a good signal may not be obtained with Raman spectroscopyanalyzation and/or other analyzation methods. One or more of thescanning methods described above may be configured not to scan theoverlapping portions.

In some configurations where the sample includes, for example, organicmatter such as cells, the method of analyzing and/or processing thesample may include identifying areas of interest, such as components ofthe cell and/or other organic matter (e.g., nucleus, cytosol, proteins,etc.). The areas if interest may be identified, for example, usingvisible light, ultraviolet light and/or other analyzation methods.

In some configurations, the images and/or data obtained from the visiblelight, ultraviolet light and/or other analyzation methods may be used toidentify one or more portions and/or components of one or more cells.The identified portions and/or components may be used to automaticallyand/or manually configure a scanning method to keep one or more of thecells viable. For example, the characteristics of the scanning method,such as the power of electromagnetic radiation, may be automatically ormanually selected for the identified portions and/or components suchthat components of the one or more of the cells are not destroyed. Insuch configurations, the entire sample may be scanned, but withdifferent characteristics of the scanning method, for example, asillustrated and described with respect to FIG. 8D above.

In some configurations, a method of analyzing and/or processing a samplemay include identifying cells in wells of a sample tray. The method ofanalyzing and/or processing a sample may include identifying an amountof suitable and/or desired targets. The targets may selected based onany suitable characteristics, for example: the amount of occlusion ofthe cells by other cells; and/or the visibility of components of thecells such as the nucleus; and/or portions of the cells that are blockedby substances such as feeding media. The method of analyzing and/orprocessing a sample may include automatically or manually generating adatabase of targets. The database of targets may include X, Y and Zcoordinates for the target cells and/or components of the target cellssuch as the nucleus, the cytosol, and/or the membrane. The method ofanalyzing and/or processing a sample may include configuring a scanningmethod to scan the target cells and/or components of the target cells.For example, a Raman spectroscopy scan may be configured to scan thetarget cells and/or components of the target cells. The data from thescanning method (e.g., the Raman spectroscopy scan) may be used toautomatically or manually identify protein and/or the lipid expressionfor the scanned portions.

Additionally or alternatively, data from the scanning method (e.g., theRaman spectroscopy scan) may be used to automatically or manuallydetermine trends and/or characteristics of a cell population. Forexample, data from a first scan may be compared to one or moresubsequent scans at one or more of the same positions to determinetrends and/or characteristics of a cell population. For example, datafrom a first scan may be compared to one or more subsequent scans (forexample, in a subsequent hour and/or two hours) to determine the healthof a cell population.

With reference to FIG. 9, a method 900 method of analyzing and/orprocessing a sample will be described in further detail. In someconfigurations, the method 900 may be implemented by the system 40. Itshould be appreciated that the method 900 may be implemented in othermanners and/or with other embodiments. As illustrated for example inFIG. 9, the example method 900 may include a step 910 of scanning thesample using a first scanning method with a first electromagneticradiation. The method 900 may include a step 920 of identifying one ormore contaminants and/or areas of interest of a sample. The method 900may include a step 930 of scanning the sample using a second scanningmethod with a second electromagnetic radiation based on the position ofthe contaminants and/or areas of interest. The method 900 may includeany suitable aspects described above.

FIGS. 10A-10E illustrate a device 500 that may be used as part of thesystem 40 in configurations for analyzing fluid samples such as liquids,gels, gases, and/or other fluidic substances. In some configurations,the device 500 may be used instead of the interface assembly 80. Thedevice 500 may include any suitable aspects as described with respect tothe interface assembly 80. A description of some similar and/or sameaspects of the device 500 may not be included for brevity.

FIGS. 10A and 10B are perspective views of the device 500. Asillustrated, the device 500 may include a first body portion 502 and asecond body portion 504. The device 500 includes a window 584 that isconfigured to permit light to travel through at least a portion of thedevice 500. The window 584 may be at least partially transparent ortranslucent and/or may be configured to convey, direct, collimate and/orfocus light travelling through the device 500.

The device 500 may be configured to interface with other portions of thesystem 40, such as the head assembly 70 and/or other components of thesystem 40 described above. As illustrated, the first and second bodyportions 502, 504 may define an aperture 586 extending at leastpartially through the device 500. The aperture 586 may be configured(e.g. shaped and/or dimensioned) to permit electromagnetic radiation totravel through at least a portion of the device 500 to the window 584.

As illustrated for example in FIG. 10B, the second body portion 504 maydefine a receptacle 588 with an optoelectronic assembly such as theoptoelectronic assembly 90 positioned therein. The optoelectronicassembly 90 is described in further detail above, for example, indescriptions associated with FIGS. 5A and 5B. The optoelectronicassembly 90 may be removably or non-removably fastened to the device 500inside of the receptacle 588.

As illustrated, the device 500 may include an inlet 510 and an outlet514 which may be positioned on the second body portion 504. The inlet510 and the second body portion 504 may define an inlet conduit 512configured to permit fluid (e.g., liquids and/or gases) to enter thedevice 500. The outlet 514 and the second body portion 504 may define anoutlet conduit 516 configured to permit fluid (e.g., liquids and/orgases) to exit the device 500. In some circumstances, the gaseous orliquid fluid may include solid substances and/or particles.

FIG. 10C illustrates a cross sectional view of the device 500 and FIG.10D illustrates a cross sectional view of a portion of the device 500.The window 584 may be positioned between the first and second bodyportions 502, 504. The device 500 may include a seal 506 configured toseal the window 584. The seal 506 may be an 0-ring.

In some configurations, the seal 506 may contribute to forming aninterface between the window 584 and/or the first and second bodyportions 502, 504 such that fluid may not pass. A chamber 518 may bedefined between the window 584 and a second window 520 occluding theaperture 586.

The windows 520, 584 may be each positioned at least partially insidethe aperture 586 and may define the chamber 518 within the aperture 586between the windows 520, 584. The windows 520, 584 may occlude theaperture 586 and may permit light to travel through the device 500, forexample, between the fluid sample and the objective 102 of the headassembly 70. The optoelectronic assembly 90 may be coupled to the device500 such that the objective 102 of the head assembly 70 is a specifieddistance or range of distances from the optoelectronic assembly 90.Additionally or alternatively, the device 500 may be configured suchthat the chamber 518 is dimensioned and/or shaped to analyze as specificvolume of the fluid sample.

In operation, a sample fluid may be directed into the chamber 518 andover the window 520 such that the head assembly 70 may analyze and/orprocess the fluid sample. The head assembly 70 may be activated and thefluid sample may be analyzed and/or processed. The fluid sample may becontinuously or incremental analyzed and/or processed. For example, insome configurations the fluid sample may be continuously analyzed as itflows through the device 500. In other configurations, flow of the fluidsample may be stopped at a position over the window 520 and fluid samplemay be incrementally analyzed. In such configurations, the device 500may include one or more valves or other aspects to segment portions ofthe fluid sample.

In some configurations, the device 500 and/or the system 40 may includedynamic light scattering analysis. An example of the device 500 and/orthe system 40 that includes dynamic light scattering analysis isillustrated in FIG. 10E.

In such configurations, the device 500 may be coupled to a peristalticpump 530, as illustrated. Additionally or alternatively, the system 40may include a conduit and/or an assembly 532 with plurality of conduits534 a-d coupled to the device 500. The plurality of conduits 534 a-d mayinclude conduits 534 a-d of different dimensions that may be selected tocorrespond to the density of the particles in the gaseous or the liquidfluid. A corresponding one of the conduits 534 a-d may be selected forparticles of a specific density.

FIG. 10F illustrates a corresponding conduit 534. The system 40 mayinclude a plurality of emitters 536 a-d that may be positioned aroundthe conduit 534. The emitters 536 a-d may direct light through theconduit 534 to analyze the particles in the gaseous or the liquid fluid.Specifically, the system 40 may analyze reflections and/orscintillations from particles in a gaseous or liquid fluid (e.g.,solution, air, etc.) to obtain data. The data may include an angularand/or time varying signal signals. The frequency of the signals may becompared to the angle of the signals to determine information regardingthe characteristics of the particles in the gaseous or the liquid fluid,such as dimensions and/or shape.

FIGS. 11A and 11B illustrate alternative embodiments of systems that maybe configured to be used as a part of production line to analyze andprocess samples to obtain information about aspects of the productionline, such as characteristics of the finished products or intermediariesof the products. The systems may be implemented as an in-processmonitoring systems integrated into a production line and configured toanalyze one or more properties of a sample as it is being produced. Anyor all aspects described above with respect to system 40 may beincorporated into the systems of FIGS. 11A and 11B. Additionally oralternatively, the systems of FIGS. 11A and 11B may include any suitableaspects described in U.S. patent application Ser. No. 14/507,637,entitled “OPTICAL AND CHEMICAL ANALYTICAL SYSTEMS AND METHODS” and U.S.patent application Ser. No. 14/454,483, entitled “ANALYSIS AND PURGINGOF MATERIALS IN MANUFACTURING PROCESSES,” which are both incorporated byreference in their entirety.

FIG. 12A illustrates an analysis configuration 600 that may be used, forexample, in immersion microscopy. As illustrated, the analysisconfiguration 600 may include an objective 602 configured to analyze asample 606 through a window 604. The window 604 may be a coverslip, aportion of a well plate, or any of the windows described in thisdisclosure.

As illustrated, a layer of immersion oil 608 is positioned between theobjective 602 and the window 604. The immersion oil 608 may beconfigured to direct and/or focus electromagnetic radiation travellingbetween the objective 602 and the window 604. The immersion oil 608 maybe retained by characteristics of the immersion oil 608 such as surfacetension. In such configurations, if the objective 602 is moved, forexample in the X or Y directions as illustrated, the surface tension ofthe immersion oil 608 may be broken and the immersion oil 608 may leavethe position between the objective 602 and the window 604.

In the analysis configurations 600, if the objective 602 is to analyzemore than one sample, such as the sample 606, the immersion oil 608 maybe removed and the objective 602 and/or the window 604 may requirecleaning to remove the oil and/or contaminants. In such configurations,the immersion oil 608 may then be manually reapplied between theobjective 602 and the window 604. For example, if the window 604 is partof a well plate, the immersion oil 608 may be removed and reapplied toanalyze more than one sample of the well plate.

FIG. 12B illustrates an analysis configuration 610 that may be used, forexample, as an alternative to the analysis configuration 600. Asillustrated, the analysis configuration 610 includes a deformable member614 including a membrane 618 defining a bladder filled with a gel or afluid 616 (although fluid 616 will be used in the following description,the fluid 616 may be a gel). The deformable member 614 may be capable ofbeing deformed by the objective 602 and/or the window 604. Thedeformable member 614 may be capable of being deformed to correspondwith at least one surface of the objective 602 and/or at least onesurface the window 604. As illustrated, the deformable member 614 maydeform to generally correspond with the shape of the space between theobjective 602 and/or the window 604. The deformable member 614 may be atleast partially transparent or translucent and/or may be configured toconvey, direct, collimate and/or focus light travelling between theobjective 602 and the window 604. When the deformable member 614deforms, it may continue to retain the fluid 616 inside of the membrane618. Although the shape of the deformable member 614 may change, thevolume of fluid 616 retained inside of the membrane 618 may besubstantially constant. Additionally or alternatively, the deformablemember 614 may elastic and/or resilient.

Although the membrane 618 and the fluid 616 may be formed of anysuitable materials, in some configurations the membrane 618 may includea polymer such as a silicone. The membrane 618 may be a solid orsemi-solid substance that is configured to enclose the fluid 616. Insome configurations, the membrane 618 may be a solid or semi-solidsilicone. In further configurations, the membrane 618 may be avulcanized silicone. The fluid 616 may be liquid or gel substance thatpermits the deformable member 614 to deform. The fluid 616 may includean immersion fluid or a substance similar to an immersion fluid used inmicroscopy. In some configurations, the fluid 616 may be a liquid or gelpolymer such as a silicone oil. Both the membrane 618 and the fluid 616may be at least partially transparent or translucent and/or may beconfigured to convey, direct, collimate and/or focus light travellingbetween the objective 602 and the window 604.

As illustrated in FIGS. 12C and 12D, the deformable member 614 maypermit the objective 602 to be moved at least in the X and the Ydirections. Additionally or alternatively, the deformable member 614 maypermit the objective 602 to be moved in the Z direction (notillustrated). As illustrated in FIGS. 12C and 12D, as the objective 602is moved, the deformable member 614 may deform and adapt to the movementof the objective 602. In such configurations, the deformable member 614may continue to convey, direct, collimate and/or focus light travellingbetween the objective 602 and the window 604 as the objective 602 ismoved.

Unlike the analysis configuration 600 including the immersion oil 608,the deformable member 614 does not need to be replaced when theobjective 602 is moved. Specifically, the fluid 616 is retained by themembrane 618 and thus the fluid 616 does not leave the position betweenthe objective 602 and the window 604, for example, because of a loss ofsurface tension. Additionally or alternatively, the deformable member614 may be cleaned, for example, to remove contaminants. In contrast, ifimmersion oil is used, it may be susceptible to fouling by contaminantsand may need to be discarded.

As illustrated for example in FIG. 12D, the analysis configuration 610may permit the objective 602 to be moved to analyze different portionsof the sample 606. Additionally or alternatively, the analysisconfiguration 610 may permit the objective 602 to be moved to focus theanalysis configuration 610.

In some configurations, the deformable member 614 may include at leastone dimension between 0 and 500 microns, between 0 and 400 microns,between 100 and 200 microns, or any other range spanning and combinationbetween 0 and 500 microns. In other configurations, the deformablemember 614 may include at least one dimension greater than 500 microns.

In some configurations, forming the deformable member 614 may includeforming a drop of liquid or gel substance. For example, the substancemay be a liquid or gel polymer such as silicone. Forming the deformablemember 614 may include processing the outside surface of the drop toform a coating that may form the membrane 618. Forming the deformablemember 614 may include processing the outside surface of the drop toform a coating with a liquid or gel substance inside of the coating thatmay form the fluid 616.

In some configurations, forming the deformable member 614 may includevulcanizing an outer portion of the drop to form the membrane 618 withthe fluid 616 positioned inside. In other configurations, forming thedeformable member 614 may include forming the membrane 618 by anysuitable method and then positioning the fluid 616 inside of themembrane 618, for example, by injecting the fluid 616.

The configuration (e.g., shape, dimensions, etc.) of the deformablemember 614 may be adapted to be used with any suitable window oranalysis configurations. For example, the deformable member 614 may beconfigured to be used with any suitable aspects of the systems describedabove.

The deformable member 614 may permit either or both the objective 602and/or the window 604 to break contact with the deformable member 614without permitting the fluid from leaving a position between theobjective 602 and the window 604. Such configurations may permit theobjective 602 to be repositioned to other portions of the window 604and/or to analyze other samples through other windows.

In some configurations, a system incorporating the analysisconfiguration 610 may be configured to automatically or manually removethe deformable member 614 and/or discard the deformable member 614 afteranalyzing one or more samples to facilitate in preventing contaminationbetween samples. After the deformable member 614 is removed and/ordiscarded, the may be configured to automatically or manually positionanother deformable member, for example, over the objective 602 or otherpositions.

FIG. 12E illustrates another example of an analysis configuration 620.As illustrated, in some configurations, the analysis configuration 620may include a sheet or array 622 of deformable members 614 a, 614 b, 614c, etc. Each of the deformable members 614 a, 614 b, 614 c may includecorresponding fluid 616a, 616b, 616c retained by membranes 618 a, 618 b,618 c.

As illustrated, the deformable members 614 a, 614 b, 614 c may beoperably coupled to one another in the array 622. At least a portion ofthe array 622 with one of the deformable members 614 a, 614 b, 614 c,may be positioned between the objective 602 and the window 604 to permitthe sample 606 to be analyzed. Once the sample 606 is analyzed, theobjective 602 and/or the window 604 may be repositioned and a second oneof the deformable members 614 a, 614 b, 614 c, may be positioned betweenthe objective 602 and the window 604 to permit another sample to beanalyzed. Such configurations may facilitate in preventing contaminationbetween samples. System incorporating the analysis configuration 620 maybe configured to automatically or manually reposition the array 622and/or the deformable members 614 a, 614 b, 614 c, and/or discard one ormore of the deformable members 614 a, 614 b, 614 c, after analyzing oneor more samples.

FIGS. 12F and 12G illustrate another example of an analysisconfiguration 630. As illustrated, in some configurations, an objective602 a may include a receptacle 632 configured to receive at least aportion of a deformable member 614 d. The deformable member 614 d mayinclude a bladder defined by a membrane 618 d and the receptacle 632. Asillustrated, the receptacle 632 and the membrane 618 d may cooperate toretain a fluid 616 d. In such configurations, the deformable member 614d may be integrated with the objective 602 a. Such configurations of theobjective 602 a and/or the deformable member 614 d may facilitate inretaining the deformable member 614 d with respect to the objective 602a. The analysis configuration 630 c may include any suitable aspects andadvantages described with respect to FIGS. 12A-12D.

As illustrated in FIG. 12G the deformable member 614 d may be positionedagainst the window 604 to analyze the sample 606. The deformable member614 d may permit the objective 602 a to be moved at least in the X andthe Y directions. Additionally or alternatively, the deformable member614 d may permit the objective 602 a to be moved in the Z direction (notillustrated). As the objective 602 a is moved, the deformable member 614d may deform and adapt to the movement of the objective 602 a. In suchconfigurations, the deformable member 614 d may continue to convey,direct, collimate and/or focus light travelling between the objective602 a and the window 604 as the objective 602 a is moved.

Unlike the analysis configuration 600 including the immersion oil 608,the deformable member 614 d does not need to be replaced when theobjective 602 a is moved. Specifically, the fluid 616 d is retained bythe membrane 618 d and thus the fluid 616 d does not leave the positionbetween the objective 602 a and the window 604, for example, because ofa loss of surface tension. Additionally or alternatively, the deformablemember 614 d may be cleaned, for example, to remove contaminants. Incontrast, if immersion oil is used, it may be susceptible to fouling bycontaminants and may need to be discarded.

The analysis configuration 630 may permit the objective 602 a to bemoved to analyze different portions of the sample 606. Additionally oralternatively, the analysis configuration 630 may permit the objective602 a to be moved to focus the analysis configuration 630.

FIGS. 12H-12J illustrate another example of an array 650 that mayinclude any or all suitable aspects described with respect to the array622. As illustrated, the array 650 may be configured to be used with asample tray such as the sample tray 204 described with respect to thedevice 200. As illustrated, the array 650 may include a body sized andshaped to correspond with the sample tray 204. The array 650 may includeor be formed of a polymer such as a silicone. The array 650 may includeor be formed of a solid or semi-solid substance. In some configurations,the array 650 may include or be formed of solid or semi-solid silicone.In further configurations, the array 650 may include or be formed of avulcanized silicone.

As illustrated for example in FIG. 121, the array 650 may include one ormore lenses 652. As illustrated, the configuration (e.g., size, shape,positioning, amount) of the lenses 652 may correspond to the wells 206of the sample tray 204. As illustrated, the lenses 652 may be configured(e.g., dimensioned and/or shaped) to convey, direct, collimate and/orfocus light travelling between the objective 602 and the window 604. Forexample, the lenses 652 may be sized and/or shaped to be deformedbetween the objective 602 and the window 604 to convey, direct,collimate and/or focus light travelling between the objective 602 andthe window 604.

The lenses 652 may include or be formed of a polymer such as a silicone.In some configurations, the lenses 652 may include or be formed of asolid or semi-solid substance. In other configurations, the lenses 652may include or be formed of a fluid or gel substance. In someconfigurations, the lenses 652 may include or be formed of solid,semi-solid, fluid and/or gel silicone.

In some configurations, the lenses 652 may be formed on the surface ofthe array 650. For example, the surface of the array 650 may be sizedand shaped to form the lenses 652. In another example, the lenses 652may be formed by processing a liquid or gel substance, for example byvulcanization, to form a solid or semi-solid substance that define thearray 650 and/or encloses a fluid, as described above with respect toFIGS. 12B-12D.

The array 650 and/or the lenses 652 may be deformable to permit theportions of the array 650 deform between window 604 and/or the objective602. The array 650 and/or the lenses 652 may be configured to deform tocorrespond to surfaces of the window 604 and/or the objective 602. Thearray 650 and/or the lenses 652 may be at least partially transparent ortranslucent and/or may be configured to convey, direct, collimate and/orfocus light travelling between the objective 602 and the window 604.

The system 40 may include any suitable configurations and/orcombinations of configurations described above. The system 40 may beconfigured to include one or more aspects described with respect to thedevices 200, 300, 400, and/or 500. One example configuration of thesystem 40 including aspects from more than one of the devices 200, 300,400, and/or 500 will now be described in further detail.

In some configurations, the system 40 may include a reaction vessel or acrystallization tube and flow lines coming from different sections ofthe reaction vessel driven by a peristaltic pump that pumps fluid to thesystem 40. The flow lines may be coupled, for example, to a sample traypositioned in the device 200. The sample tray may include aspectssimilar to the sample tray 204, and may further include fluidic and/ormicrofluidic channels that permit the device 200 to analyze and/orprocess one or more fluid samples from the reaction vessel. The device200 may be further coupled to an evacuation system configured to permitthe fluid samples to be evacuated and/or purged from the device 200.

The evacuation system coupled to the device 200 may include any suitableaspects described above, for example: a compressor or a vacuumconfigured to generate negative pressure to evacuate and/or purge thefluid samples; a switch configured to selectively couple the vacuum toone or more vessels configured to retain portions of the fluid samplesevacuated and/or purged from the device 200; and/or outlets coupled tothe one or more of the vessels that may permit portions of the fluidsamples in corresponding vessels to be continuously or incrementallyremoved from the vessels. The evacuation system coupled to the device200 may be configured to aggregate and/or concentrate one or morecomponents of the fluid samples in a manner similar to any of thosedescribed above. Specifically, the switch may be selectively coupled toone of the vessels to aggregate and/or concentrate one or morecomponents of the fluid samples in that one of the vessels. The switchmay be selectively coupled to one of the vessels based on data fromanalyzing the fluid samples by the head assembly 70 via the interfaceassembly 80 and the device 200.

In some configurations, the sample tray with fluidic and/or microfluidicchannels may permit sample dissolution to be analyzed by the system 40.For example, the system 40 may be used to analyze one or more pills todetermine dissolution characteristics such as rate and/or repeatabilityover a number of pills.

Aspects of the present disclosure may be embodied in other forms withoutdeparting from its spirit or characteristics. The described aspects areto be considered in all respects illustrative and not restrictive. Allchanges which come within the meaning and range of equivalency of theclaims are to be embraced within their scope.

What is claimed is:
 1. A hyperspectral analyzation subassemblyconfigured to obtain information for a sample, the hyperspectralanalyzation subassembly comprising: one or more transmitters to generateelectromagnetic radiation electromagnetically coupled to the sample; oneor more sensors to detect electromagnetic radiation electromagneticallycoupled to the sample; an electromagnetically transmissive window toreceive the sample, wherein at least one of the sensors detectselectromagnetic radiation from the sample via the window; and ananalyzation actuation subassembly to actuate at least a portion of thehyperspectral analyzation subassembly in one or more directions ofmovement with respect to the sample.
 2. The hyperspectral analyzationsubassembly of claim 1, wherein the analyzation actuation subassemblyfurther comprises: a first actuator to actuate at least the portion ofthe hyperspectral analyzation subassembly in a first direction ofmovement; a second actuator to actuate at least the portion of thehyperspectral analyzation subassembly in a second direction of movement;and a third actuator to actuate at least the portion of thehyperspectral analyzation subassembly in a third direction of movement.3. The hyperspectral analyzation subassembly of claim 2, furthercomprising: an optical multiplexer electromagnetically coupled to anobjective, wherein the optical multiplexer directs electromagneticradiation travelling between the sample and at least one of the one ormore sensors and/or the one or more transmitters; and an objectiveelectromagnetically coupled between the window and the opticalmultiplexer, the objective focusing electromagnetic radiation travellingto or from the sample.
 4. The hyperspectral analyzation subassembly ofclaim 1, further comprising a computerized subassembly configured to oneor more of: transmit power and/or control signals to the analyzationactuation subassembly to scan the sample; and receive data from thehyperspectral analyzation subassembly to obtain information regardingthe sample.
 5. The hyperspectral analyzation subassembly of claim 1,wherein: at least one of the transmitters includes a Raman laser sourceoptically coupled to the sample; and at least one of the sensors is aRaman spectrometer optically coupled to the sample.
 6. The hyperspectralanalyzation subassembly of claim 1, wherein at least one of thetransmitters generates ultraviolet radiation directed at the sample. 7.A system comprising the hyperspectral analyzation subassembly of claim 1coupled to a device configured to analyze one or more samples positionedin a sample tray, the device comprising: a tray holder configured toreceive a sample tray including a plurality of wells, the sample trayconfigured to permit electromagnetic radiation to travel through thesample tray to one or more samples positioned inside of the wells; afirst actuator configured to actuate the tray holder in a firstdirection of movement; and a second actuator configured to actuate thetray holder in a second direction of movement.
 8. The system of claim 7,further comprising an electronic assembly electrically coupled to thefirst actuator and the second actuator, the electronic assemblyconfigured to control the first actuator and the second actuator toposition each of the wells of the sample tray with respect to thehyperspectral analyzation subassembly to scan the samples positionedinside of the wells.
 9. The system of claim 7, wherein: the sample trayis removably positioned at least partially inside of the tray holder;the samples are positioned on a first side of the sample tray; and thehyperspectral analyzation subassembly analyzes the samples bytransmitting electromagnetic radiation through an oppositely positionedsecond side of the sample tray.
 10. A system comprising thehyperspectral analyzation subassembly of claim 1 coupled to a deviceconfigured to analyze fluid samples, the device comprising: a bodydefining an aperture; a first window and a second window occluding theaperture and configured to permit electromagnetic radiation to travelthrough the aperture; a chamber defined between the first window and thesecond window; an inlet defined in the body and configured to permitfluid samples to enter the chamber; and an outlet defined in the bodyand configured to permit fluid samples to exit the chamber.
 11. Thesystem of claim 10, wherein a fluid sample is directed into the chamberthrough the inlet adjacent to the first window, the hyperspectralanalyzation subassembly is functionally coupled to the chamber via oneor more of the first window or the second window to analyze and/orprocess the fluid sample, and the fluid sample exits the chamber throughthe outlet.
 12. The system of claim 10, further comprising one or morevalves configured to segment portions of the fluid sample.
 13. Thesystem of claim 11, further comprising a peristaltic pump fluidlycoupled to the inlet and a plurality of conduits coupled to the outlet,wherein each of the plurality of conduits is sized and shaped forparticles of a specified density.
 14. A system for analyzing a samplecomprising: an objective; a window configured to receive a sample; adeformable member positioned between the window and the objective, thedeformable member including a membrane defining a bladder filled atleast partially with a fluid, the deformable member capable of deformingto permit the objective to move with respect to the window.
 15. Thesystem of claim 14, wherein the deformable member and the window permitelectromagnetic radiation to travel between the objective and thesample.
 16. The system of claim 14, wherein the deformable member is atleast partially optically transparent and conveys electromagneticradiation travelling to or from the sample.
 17. The system of claim 14,wherein the deformable member deforms to a shape corresponding to aspace between the objective and the window.
 18. The system of claim 14,wherein the deformable member is capable of deforming to permit theobjective to move with respect to the window in at least two directionsof movement.
 19. The system of claim 14, wherein the membrane is avulcanized silicone and the fluid is a silicone oil.
 20. The system ofclaim 14, wherein the deformable member is part of an array ofdeformable members configured to be used in analyzing a plurality ofsamples.